Reduction of Packaging Size by the High-Performance Molded Pulp

Category: 
Electronics
Company: 
KYOCERA Document Solutions Inc.
Country: 
Japan

The molded pulp developed for the protection of products with external protrusions. By folding the part of the molded pulp to change buffer direction, external protrusions can be protected even with reduced buffer distance of 14.5 mm. As a result, the reduction of overall packaging size is achieved.